![]() ![]() I wrote a simple benchmark consisting of a loop with a large number of iterations. I wanted to test the instruction throughput of various floating point instructions. We will look at 5 CPU cores today: the ARM Cortex A9, ARM Cortex A15, Qualcomm Scorpion, Qualcomm Krait 200 and Qualcomm Krait 300. For this article I'm focusing exclusively on floating point performance. In this spirit, I wrote a few synthetic tests to better understand the performance of current-gen ARM CPU cores without having to rely upon vendor supplied information. We've done quite a bit of low-level mobile CPU analysis at AnandTech in pursuit of understanding architectures where there is no publicly available documentation. This situation frustrates me to no end personally. ![]() Often times all that's available are marketing slides with fuzzy performance claims. However, unlike desktop and server CPUs, mobile CPU and GPU vendors tend to do very little architectural disclosure - a fact that we've been working hard to change over the past few years. Additionally, the versatility of Ge facilitates photon emission, modulation, and detection simultaneously with a simple process complexity and low cost.As a programmer who wants to write decent performing code, I am very interested in understanding the architectures of CPUs and GPUs. Compared with a III-V-based Si laser, the biggest potential advantage of a Ge-on-Si laser lies in its material and processing compatibility with Si technology. The Germanium (Ge)-on-Si laser is also competitive for large-scale monolithic integration in the future. The superior temperature-insensitive characteristics of the QD laser promote this design in large-scale high-density OEICs. The demonstration of high-performance quantum dot (QD) lasers monolithically grown on Si strongly forecasts its feasibility and enormous potential for on-chip lasers. However, in the long term, direct hetero-epitaxial growth of III–V materials on Si seems more promising for low-cost, high-yield fabrication. Currently, III-V-based silicon (Si) lasers formed via bonding techniques demonstrate the best performance and display the best opportunity for commercial usage in the near future. Additionally, the performance of each contender is also assessed with respect to thermal stability, which is a crucial parameter to consider in complex optoelectronic integrated circuits (OEICs) and optical interconnections. Here, we briefly review the history and recent progress of a few promising contenders for on-chip light sources in terms of operating wavelength, pump condition, power consumption, and fabrication process. Serving as the electrical to optical converter, the on-chip silicon light source is an indispensable component of silicon photonic technologies and has long been pursued. ![]() We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates. This is leading to exciting possibilities in microassembly. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Additionally, new device configurations can be achieved that could not otherwise be realised. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. The essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |